RELIFE TF1 Mini Insulated tempered glass fixture TF1 Mini

1.Commonly used in various mobile phone motherboards, small and portable, chip clamping.

2.Suitable for motherboard repair, chip degumming, etc., supports more chips, CPUs, hard disks and other IC clamping.

3.Made of high-quality silicone, high strength, wear resistance, corrosion resistance, high temperature resistance and anti-scalding, protecting working hands.

4.Inward bevel design, precise and firm clamping, motherboard suspended in the air to effectively prevent heat loss caused by motherboard heat conduction, quick desoldering to protect motherboard.

5.High temperature resistant tempered glass panel，High temperature resistant 500℃+, long-term use without deformation, no fear of high temperature.

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