RELIFE IPZ13 IP14/14Plus/14Pro/14ProMax-A15/16 CPU integrated stencil/thick 0.12MM RL-044 IP14
1.Suitable for IP14/14 Plus/14 Pro/14 Pro Max.
2.The real machine is measured to ensure accuracy. Each mesh is calibrated according to the original drawings to ensure that every solder joint is not missing; the special chip is half-cut design to block the remaining tin to meet different requirements.
3.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
4.Ultra-thin design, better fit of tin planting, continuous bending and full toughness.
Reviews
"Supports IP14 model, very thin,very practical."
---Jason---
"Excellent tool, high temperature resistance and good metal fatigue resistance, very good."
---Bryant---
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