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SSSP-50

CPU SOLDER PASTE SSSP-50

1. 158 degree ,Customized for BGA IC welding .

2. soldering joint bright ,full, non-soldering ball , moderate viscosity.

3.After welding ,less residue ,appearance and transparency ,high insulation resistance .

4.Has good wettability ,excellent welding .

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Specifications

EAN(Gtin13): 6971806512063

Brand: SUNSHINE

Model: SSSP-50

Sku: 1

Reviews

"Fine paste, has good wettability ,excellent welding ."

---Shally---

"Good solder paste, soldering joint bright ,full, non-soldering ball."

---Pally---

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0086 188 1329 3139

sunshine01@exinxun.com

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